We try to stick to the 0805 parts because they’re still big enough to solder by hand. But [Scott] shows us that it doesn’t take too many special tools to reflow fine-pitch components at home. In this ...

SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero- halogen solder paste is specifically designed for fine-pitch ...

Tessera this morning announced an alternative to ubiquitous ball-grid technology that could significantly change both chip-scale packaging and more complex assemblies such as package-in-package ...

You have some fine pitch soldering to do, but all you have on hand is a big soldering iron. What do you do? There are a few possible answers, but [Mr SolderFix] likes to pull a strand from a large ...

CN-1736 is a reworkable underfill designed for use with 0.4-mm-pitch package-on-package (POP) assemblies. With low viscosity, lower coefficient of thermal expansion (CTE) than previously, and greater ...

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...

Indium Corporation will feature its Indium3.2HF solder paste at Semicon Taiwan 2018 from September 5-7. Indium Corporation's Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3 ...