The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

Micron Technology (NasdaqGS:MU) starts volume production of next generation HBM4 memory a quarter ahead of its prior timeline. The company reports that all of its 2026 HBM capacity is already sold out ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

Memory, especially High Bandwidth Memory, plays an important role in ensuring AI workloads run efficiently and fast, reducing ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Memory chips used to be considered low-margin commodity products. Now the industry can’t make enough to satisfy data centers’ hunger.

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

Micron has been one of the biggest winners in the AI boom.

Editor’s Note: Sign up for CNN’s Meanwhile in China newsletter which explores what you need to know about the country’s rise and how it impacts the world. The US government has imposed fresh export ...

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...