A series of RF power amplifier modules from NXP provides top-side cooling to enable up to 30% thinner and lighter massive MIMO radios for 5G infrastructure. The A5M34TG140-TC, A5M35TG140-TC, and ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
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