Cleaving is a fast and simple technique used for preparing samples of silicon and other semiconductor materials; however, sapphire, despite being a single crystal material, does not cleave well.

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.

Dublin-based equipment maker Xsil today said it is ready to ship a fully automated laser-dicing tool for thin wafers that it says works without chipping or cracking. Once upon a time within the ...

NVT has recently developed the fastest, most advanced and most versatile laser singulation and metrology tools in the ...

KLA-Tencor Corp. today released the SpectraFx 100, its fifth-generation optical thin-film metrology system that incorporates the company’s patented Resolution optics with a small resolution spot, ...